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Endurance-aware security enhancement in non-volatile memories using compression and selective encryption

Jalili, M ; Sharif University of Technology

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  1. Type of Document: Article
  2. DOI: 10.1109/TC.2016.2642180
  3. Abstract:
  4. Emerging non-volatile memories (NVMs) are notable candidates for replacing traditional DRAMs. Although NVMs are scalable, dissipate lower power, and do not require refreshes, they face new challenges including shorter lifetime and security issues. Efforts toward securing the NVMs against probe attacks pose a serious downside in terms of lifetime. Cryptography algorithms increase the information density of data blocks and consequently handicap the existing lifetime enhancement solutions like Flip-N-Write. In this paper, based on the insight that compression can relax the constraints of lifetime-security trade-off, we propose CryptoComp, an architecture that, taking the advantage of block size reduction after compression, aims to enhance the memory system lifetime and security. Our idea is to limit the avalanche effect caused by encryption algorithms in a lower space through compression and selective encryption. This way, for highly compressible data blocks, we follow a fully-encryption approach while for poorly compressible data blocks, we rely on a non-deterministic fine-grain selective-encryption mechanism. Additionally, a simple and block-oriented wear-leveling scheme is presented to fairly distribute the bit flips on memory cells. Our experimental results show 3.59× and 3.66× lifetime improvements over two state-of-the-art schemes, DEUCE and i-NVMM, while imposing a negligible performance degradation of 2.1 percent, on average. © 2016 IEEE
  5. Keywords:
  6. Hard error ; Data compression ; Data storage equipment ; Digital storage ; Dynamic random access storage ; Phase change memory ; Hard errors ; Lifetime ; Main memory ; Non-volatile memory ; Security ; Cryptography
  7. Source: IEEE Transactions on Computers ; Volume 66, Issue 7 , 2017 , Pages 1132-1144 ; 00189340 (ISSN)
  8. URL: https://ieeexplore.ieee.org/document/7792116