Numerical Study on Stress Distribution of SolderJoints Based on Solder Microstructure, M.Sc. Thesis Sharif University of Technology ; Nourani, Amir (Supervisor)
Abstract
In the past, lead-based solders with homogeneous and isotropic behavior were used in microelectronic packages. But today, due to the environmental concerns of lead, lead-free solders have been developed, which consist of a high weight percentage (more than 90%) of tin. Tin crystal shows significant anisotropic behavior, which leads to an anisotropic joint response in miniature solder joints with a small number of grains. In the first part of this research, using the crystal plasticity model, the anisotropic plastic response of tin grain was extracted from bulk solder stress-strain curve, then it was implemented in Abaqus software using built-in Hill's anisotropic plasticity model to consider...
Cataloging briefNumerical Study on Stress Distribution of SolderJoints Based on Solder Microstructure, M.Sc. Thesis Sharif University of Technology ; Nourani, Amir (Supervisor)
Abstract
In the past, lead-based solders with homogeneous and isotropic behavior were used in microelectronic packages. But today, due to the environmental concerns of lead, lead-free solders have been developed, which consist of a high weight percentage (more than 90%) of tin. Tin crystal shows significant anisotropic behavior, which leads to an anisotropic joint response in miniature solder joints with a small number of grains. In the first part of this research, using the crystal plasticity model, the anisotropic plastic response of tin grain was extracted from bulk solder stress-strain curve, then it was implemented in Abaqus software using built-in Hill's anisotropic plasticity model to consider...
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