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glass-microspheres
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synergistic toughening in ternary silica/hollow glass spheres/epoxy nanocomposites
, Article Polymer - Plastics Technology and Engineering ; Volume 54, Issue 6 , 2015 , Pages 581-593 ; 03602559 (ISSN) ; Bagheri, R ; Kouchakzadeh, M. A ; Abadyan, M ; Sharif University of Technology
Taylor and Francis Inc
2015
Abstract
Herein, the fracture toughness of ternary epoxy systems containing nanosilica and hollow glass microspheres (HGMS) is investigated. The experimental measurements reveal synergistic fracture toughness in some hybrid compositions: The incorporation of 10 phr of HGMS and nanosilica alone modify the fracture toughness of epoxy by 39% and 91%, respectively. However, use of 10 phr hybrid modifier can enhance the fracture toughness of the resin up to 120%. Observations reveal different toughening mechanisms for the blends i.e., plastic deformation for silica nanoparticles and crack bifurcation for HGMS. Both of these toughening mechanisms additively contribute to the synergism in ternary epoxies
Study of synergistic toughening in a bimodal epoxy nanocomposite
, Article Journal of Reinforced Plastics and Composites ; Volume 34, Issue 4 , February , 2015 , Pages 281-292 ; 07316844 (ISSN) ; Khamesinia, A ; Bagheri, R ; Kouchakzadeh, M. A ; Abadyan, M ; Sharif University of Technology
SAGE Publications Ltd
2015
Abstract
Toughening of epoxy with different types of modifiers produces a bimodal blend that might show better fracture resistance in comparison with single-modified ones. In this research, bimodal epoxy formulations including mixtures of glass microsphere and silica nanoparticles are explored for possible synergistic toughening. The influence of composition on the glass transition temperature (Tg), tensile characteristics, and fracture toughness (KIC) is investigated. Interestingly, a synergism in fracture toughness is observed when mixtures of modifiers were incorporated. For the fixed overall modifier content, KIC is higher when the volume fraction of glass microsphere is lesser than the volume...