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Wettability and rheological behavior of low Ag lead-free SAC/graphene and cobalt-graphene nanocomposite solder paste
, Article Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science ; Volume 53, Issue 8 , 2022 , Pages 2811-2822 ; 10735623 (ISSN) ; Movahedi, M ; Kokabi, A. H ; Miyashita, Y ; Azghandi Rad, S ; Sharif University of Technology
Springer
2022
Abstract
The impacts of dopant nanoparticles, graphene nanosheets (GNSs) and cobalt decorated-graphene nanosheets (CoGNSs), were studied in relation to the wettability and rheological behavior in low-Ag lead-free SAC0307 (Sn–0.3Ag–0.7Cu) solder paste. The solidification range of the solders was evaluated using differential scanning calorimetry. Phase identification in the solder bulk and interface of the solder and copper substrate was carried out by X-ray diffraction and energy-dispersive X-ray spectroscopy. Spreading properties and reactive wetting behavior along with the rheological properties of the solders were also studied. Results showed that the addition of both nanoparticles did not...
Direct production of carbon nanotubes decorated with Cu2O by thermal chemical vapor deposition on Ni catalyst electroplated on a copper substrate
, Article Journal of Nanoparticle Research ; Volume 13, Issue 10 , October , 2011 , Pages 4681-4689 ; 13880764 (ISSN) ; Shafiekhani, A ; Vesaghi, M. A ; Sharif University of Technology
2011
Abstract
Carbon nanotubes (CNTs) decorated with Cu2O particles were grown on a Ni catalyst layer deposited on a Cu substrate by thermal chemical vapor deposition from liquid petroleum gas. Ni catalyst nanoparticles with different sizes were produced in an electroplating system at 45 °C using the corrosive effect of H2SO4 which was added to solution. These nanoparticles provide the nucleation sites for CNT growth avoiding the need for a buffer layer. The surface morphology of the Ni catalyst films and CNT growth over this catalyst was studied by scanning electron microscopy (SEM). High temperature surface segregation of the Cu substrate into the Ni catalyst layer and its exposition to O2 at...