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    Glassy carbon electrode modified with 3D graphene–carbon nanotube network for sensitive electrochemical determination of methotrexate

    , Article Sensors and Actuators, B: Chemical ; Volume 239 , 2017 , Pages 617-627 ; 09254005 (ISSN) Asadian, E ; Shahrokhian, S ; Iraji Zad, A ; Ghorbani Bidkorbeh, F ; Sharif University of Technology
    Elsevier B.V  2017
    Abstract
    In the present study, a 3D porous graphene-carbon nanotube (G-CNT) network is successfully constructed on the surface of glassy carbon electrode (GCE) by electrochemical co-deposition from a concentrated graphene dispersion. The large accessible surface area provided by the interpenetrated graphene backbone in one hand and the enhanced electrical conductivity of the 3D network by incorporating CNTs on the other hand, dramatically improved the electrochemical performance of GCE in determination of Methotrexate (MTX) as an important electroactive drug compound. Under the optimum conditions, the electrode modification led to a significant increase in the anodic peak current (∼25 times) along... 

    Exploration of temperature constraints for thermal aware mapping of 3D networks on chip

    , Article Proceedings - 20th Euromicro International Conference on Parallel, Distributed and Network-Based Processing, PDP 2012 ; 15-17 February , 2012 , pp. 499-506 ; ISBN: 9780769546339 Hamedani, P. K ; Hessabi, S ; Sarbazi-Azad, H ; Jerger, N. E ; Sharif University of Technology
    Abstract
    This paper proposes three ILP-based static thermalaware mapping algorithms for 3D Networks on Chip (NoC) to explore the thermal constraints and their effects on temperature and performance. Through complexity analysis, we show that the first algorithm, an optimal one, is not suitable for 3D NoC. Therefore, we develop two approximation algorithms and analyze their algorithmic complexities to show their proficiency. As the simulation results show, the mapping algorithms that employ direct thermal calculation to minimize the temperature reduce the peak temperature by up to 24% and 22%, for the benchmarks that have the highest communication rate and largest number of tasks, respectively. This... 

    Thermal and power aware task mapping on 3D Network on Chip

    , Article Computers and Electrical Engineering ; Volume 51 , 2016 , Pages 157-167 ; 00457906 (ISSN) Mosayyebzadeh, A ; Mehdizadeh Amiraski, A ; Hessabi, S ; Sharif University of Technology
    Elsevier Ltd 
    Abstract
    High integration and increased elements density in 3D Network on Chip (NoC) will cause more energy consumption and high temperature on chip. By mapping those tasks that have data communication between them to near cores, the communication delay and therefore, power consumption will be reduced. In addition, mapping the tasks to cores that are near the heat sink, in such a way that the generated heat is distributed indiscriminately all over the chip, will decrease maximum chip temperature. In this paper, we propose a task mapping method based on fuzzy logic that aims to alleviate power and thermal problems in 3D-NoCs. In this method, the weight of task mapping factors can be changed according...